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PI

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Polyimide (Polyimide) is an aromatic heterocyclic polymer compound whose molecular structure contains imide groups. The English name is Polyimide, or PI for short. Its density is 1.35, non-toxic, flame-retardant, and can be sterilized by high temperature. Polyimide (PI) is a super engineering plastic with excellent comprehensive properties (it can work for a long time at a high temperature of 250 degrees), and has excellent mechanical properties, thermal dimensional stability, dielectric properties, abrasion resistance, weather resistance, The properties such as wave permeability and self-lubrication are called "problem-solving masters".



Main features:


Flame retardancy: PI is a self-flammable polymer, which does not burn at high temperatures

Good mechanical properties (low sensitivity to temperature): excellent mechanical properties, high creep resistance, low thermal expansion coefficient, high dimensional stability, wear resistance, self-lubricating


Excellent thermal performance: high temperature resistance and low temperature resistance at the same time

Very high radiation resistance: the film has a strength retention rate of 90% after 5×109rad fast electron irradiation

Outstanding electrical properties: low dielectric constant and dielectric loss factor, high electrical insulation and arc resistance

Environmental performance (chemical resistance): a. Stability (resistant): acids, esters, ketones, aldehydes, phenols and aliphatic hydrocarbons, aromatic hydrocarbons, chlorinated hydrocarbons, etc.; b. Instability: chlorinated biphenyls, oxidizing acids , Oxidant, concentrated sulfuric acid, concentrated nitric acid, aqua regia, hydrogen peroxide, sodium hypochlorite


Industrial applications:

Parts with low friction coefficient and wear resistance under high speed and high pressure

Parts with excellent resistance to creep or plastic deformation

Parts with excellent self-lubricating or oil-lubricating properties

Liquid sealing parts under high temperature and high pressure

Parts with high resistance to bending, stretching and high impact resistance

Corrosion-resistant, radiation-resistant, and rust-resistant parts

Parts whose long-term use temperature exceeds 300℃ and short-term temperature reaches 400~450℃

High temperature resistant (over 260℃) structural adhesive (modified epoxy resin, modified phenolic resin, modified organic silicone adhesive, etc. where the temperature does not exceed 260℃)

For microelectronics packaging, stress buffer protection coating, interlayer insulation of multilayer interconnection structure, dielectric film, chip surface passivation, etc.


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